• Q1 Meeting: Tokyo, Japan

    March 31-April 1, 2016

    Register Now
  • Compact Model Coalition

    Standard SPICE Models

  • Q2 Meeting: Austin, Texas

    June 9-10, 2016
    Hosted at NXP

Compact Model Coalition
Industry Cost-Savings through Standard Models

The Compact Model Coalition (CMC) is a working collaborative group focused on the standardization of SPICE (Software Process Improvement and Capability Determination) device models.

When a new or enhanced chip is designed, it must first be simulated prior to manufacturing. This can be thought of as proof of concept and is vitally important as it seeks to validate the concept before it enters the capital intensive phase of manufacturing. The simulations are based on standard models (expressed in the form of equations) governed by CMC.

Once the standard models are proven and accepted by CMC, they are incorporated into the design tools widely used by the semiconductor industry. The equations at work in the standard models setting process are developed, refined and maintained by leading universities the CMC directs and funds to standardize and improve the models.

The members of our coalition are modeling experts at tech companies. All join the CMC for an important and highly valuable reason: they want to be a voice, an influencer, for themselves and their companies in the standard model setting process.

While anyone in the industry can access CMC public domain standards and models, CMC members enjoy a layer of additional benefits:

  • Early access to new solutions. CMC members can access new simulation models and existing model enhancements long before they are released to the public.
  • A voice in the selection process. Members determine which models the CMC targets for new development and which models receive ongoing CMC financial support.
  • Professional growth. CMC members enjoy the opportunity to learn from and work with the world’s most talented compact model developers from both industry and academia.
  • Free Si2 Base Membership. Our recently enhanced membership packages give CMC members a complimentary Si2 Base Membership, with opportunities to participate in special interest groups.

CMC Standard Compact Model Developers

Powering Simulations that Power the Electronics World

The University of California, Berkeley: BSIM Bulk, BSIM-SOI, BSIM-CMG, and BSIM-IMG

Dr. Chenming Hu

Chenming Calvin Hu is Distinguished Professor of Microelectronics at University of California, Berkeley. From 2001-2004, he was the Chief Technology Officer of TSMC, world’s largest IC foundry. IEEE, the world’s largest technical association, called him “microelectronics visionary” whose seminal work on metal-oxide semiconductor MOS reliability and device modeling has had enormous impact on the continued scaling of electronic devices”. He is a member of the US National Academy of Engineering, the Chinese Academy of Sciences, and Academia Sinica.

University of Hiroshima: HISIM2, HISIM HV, HSIM SOI, and HISIM SOTB

Dr. Mitiko Miura-Mattausch

Since 1996, Mitiko Miura-Mattausch has been a Professor at the Department of Electrical Engineering, Graduate School of Advanced Sciences of Matter, Hiroshima University, where she leads the Ultra Scaled Devices Laboratory. From 1981 to 1984, she was a Researcher at the Max-Planck Institute for Solid-State Physics, Stuttgart, Germany. From 1984 to 1996, she was with the Corporate Research and Development, Siemens AG, Munich, Germany, working on hot electron problems in MOSFETs, the development of bipolar transistors, and analytical modeling of deep sub-micrometer MOSFETs for circuit simulation. She has more than 300 publications and three books, is an IEEE fellow since 2001, and was honored by several awards.

University of California, San Diego: HCUM

Dr. Michael Schröter

Dr. Schröter is a Research Professor at The University of California, San Diego, and also has been appointed as Full Professor at the University of Technology at Dresden (TUD). He has more than 25 years of experience in the semiconductor industry focusing on device modeling and design as well as simulation and experimental high-frequency characterization, leading efforts at Rockwell, Nortel, Bell Northern, and Ruhr-University Ruhr-University. He has served on Technical Advisory Boards for RF Nano Corp, and RF Magic, Inc , and co-founded XMOD Technologies. Dr. Schröter currently serves as the Technical Program Manager of DOTFIVE, a large European Research project on next generation SiGe HBT technology.

Auburn University: MEXTRAM

Dr. Guofu Niu

Dr. Niu has been a Full Professor at Auburn University in the department of electrical and computer engineering since 2004. His research and teaching activities include SiGe devices, RF CMOS, high-frequency on-chip characterization, noise, radiation effects, low temperature electronics, compact modeling and TCAD. He has published over 100 journal papers and over 100 conference papers, and is the co-author of the book Silicon-Germanium Heterojunction Bipolar Transistors, Artech House, 2003 (with John Cressler), and many book chapters. Dr. Niu serves as an Editor of IEEE Transactions on Electron Devices.


Dr. Jean-Charges Barbé

Dr. Barbé is the Head of the Simulation and Compact Model Laboratory at CEA-Leti. In this role, he leads a team of thirty technical staff devoted to modeling and simulation for microelectronics processes and devices. The Lab’s activities cover atomistic simulation, TCAD and SPICE modeling; Personnal fields of activity; transport (heat and charge carriers); thermal simulations; mechanical simulation; and coupled fields

CMC Leadership

CMC Leadership represents the industry’s top semiconductor design companies and manufacturers.

In their role, they provide overall direction and guidance to the efforts of the members and the developers involved in CMC working groups.


Dr. Peter Lee

Micron Technology


Dr. Josef Watts



Dr. Richard Williams



Takeshi Naito